Packaging Engineer (ENG11003)

Location: Durham
Department: Engineering

Mission Statement:

Desired Outcomes:

·        Develop new and modified packages to meet new product development schedules 100% on-time

·        Implement strategy to cut packaging and assembly cost by 50% within 12 months

·        Reduce thermal resistance in package 35% in 12 months

·        Support internal assembly lab to ensure assembly requests are completed in less than 2 days average

·        Work with assembly suppliers to transfer new products into production and develop new assembly processes

·        Support operations to resolve technical packaging issues as needed

Core Competencies:

·        Solid understanding of assembly equipment, processes, and packaging materials – including AuSi and AuSn eutectic die attach, epoxy die attach, wedge and ball bonding, transfer molding, epoxy lid seal, and lasermarking

·        Proactive and self-motivated to accomplish tasks without being micromanaged

·        Hands-on with good mechanical skills

·        Analytically-minded and good with software tools to manage work, run analysis, create reports, etc.

·        Understanding of statistical techniques to plan and execute experiments to solve problems and improve processes

·        Able to follow through on commitments without being reminded

·        Excellent communication and comfortable working with cross-functional teams

·        Able to manage multiple projects and tasks continuously

·        Pays attention to detail to minimize errors, manage risks, and create first-success solutions

·        Minimum 3-5 years experience in semiconductor packaging

·        BS in mechanical engineering, manufacturing engineering, materials science, or comparable

·        RF packaging experience a plus

To apply, submit your resume and cover letter to:

E-mail:
jobs@nitronex.com
Fax: 919-807-9200

US Mail:
Attn: Human Resources
Nitronex Corporation
2305 Presidential Drive
Durham, NC 27703